full
border
#666666
http://www.exis-tech.com/wp-content/themes/zap-installable/
http://www.exis-tech.com/
#01acd8
style4

WTS-T Series (Wafer to Tape Sorter)

wts-t

Model WTS-T Series
Machine Type Wafer to Tape Sorter (Turret System)
Throughout
(by die size)
0.8mm – 2mm     = 12,000 UPH
2mm    – 6mm     = 10,000 UPH
6mm    – 12.0mm =   8,000 UPH
Placement
Accuracy
+/- 25um at 3 sigma
+/- 1 degree theta
 Die Size 0.8mm to 12.0mm
 Wafer Input Automated wafer loading
25 slots, for wafer up to Ø 300mm
 Vision Inspection Wafer Inspection andVision Positioning Inspection
: Bump size, shape, array
: Edge chip
: Ink dot
: Place position X, Y, ØBottom Inspection / 2D
: Edge chip
: Laser mark
: Pin 1
: Position in-pocket

Tilted Die Inspection
: Die flat in pocket

After Seal Inspection
: Die flat in pocket
: Cover tape position

Tape Width 8mm to 24mm
Reel Dimension Input        : 22″
Output      : 7″ & 13″
Cover Tape: 220mm (OD)
Network Ethernet or SECS
TCP/IP
Footprint 1900mm x 1080mm x 2150mm
Facilities Air     : 6 to 7 bars
Power: 220-240VAC, 1 PHASE 1.0KVA, 50-60Hz
Optional Flip or Non-Flip Die
Test or Non-Test
Tube Loader
Detaper to Tape
paged
Loading posts...
link_magnifier
#5C5C5C
on
loading
off