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WTS-L10 Series (Wafer to Tape Sorter)

wts-l10

Model WTS-L10 Series
Machine Type Wafer to Tape Sorter (Linear System)
Throughout
(by die size)
0.3mm – 2mm     = 10,000 UPH
2mm    – 6mm     =   9,000 UPH
6mm    – 12.5mm =   8,000 UPH
Placement
Accuracy
+/- 25um at 3 sigma
+/- 1 degree theta
 Die Size 0.3mm to 12.5mm
 Wafer Input Automated wafer loading
25 slots, for wafer up to Ø 300mm
 Vision Inspection Wafer Inspection andDie During Placement Inspection (DDP)
: Bump size, shape, array
: Edge chip
: Ink dot
: Place position X, Y, Ø

Pre-Place & Post-Place Inspection
: Edge chip
: Laser mark
: Pin 1
: Position in-pocket

Tilted Die Inspection
: Die flat in pocket

After Seal Inspection
: Die flat in pocket
: Cover tape position

Tape Width 8mm to 24mm
Reel Dimension Input        : 22″
Output      : 7″ & 13″
Cover Tape: 220mm (OD)
Network Ethernet or SECS
TCP/IP
Footprint 1980mm x 1720mm x 2150mm
Facilities Air     : 6 to 7 bars
Power: 220-240VAC, 1 PHASE 1.0KVA, 50-60Hz
Optional Flip or Non-Flip Die
JEDEC Tray Indexer
Waffle Pack Indexer
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